At Unitech, our EMS division is built to handle everything from rapid prototyping to medium and high-volume
production with a strong focus on flexibility and quality. We support high-mix, low-to-mid volume
manufacturing without strict MoQ restrictions, making us an ideal partner for both pilot builds and scaled
production. We are currently serving primarily to the automotive and medical industries and are rapidly expanding
to other industries like industrial electronics & Defense.
Our facility spans 15,000 sq. ft., equipped with two high-speed SMT lines delivering a combined capacity of 1.5
lakh CPH. We are capable of placing a wide range of components including 0201, 01005, QFP, QFN, BGA, and
Micro BGA packages.
We follow IPC Class 2 & Class 3 standards for PCB assembly and box builds, ensuring reliability for critical
applications. Quality assurance is built into every stage, supported by in-line AOI and X-ray inspection systems.
A SAP/MES-driven traceability system provides complete process visibility.
Rapid prototyping and small-batch production to validate designs quickly and accelerate time-to-market.
State-of-the-art Surface Mount Technology (SMT) and Through-Hole Technology (THT) assembly, supporting multi-layer PCBAs for various applications.
Dedicated sourcing expert ensure reliable, traceable procurement of componenets, with Vendor qualification and risk-managed alternate sourcing.
We offer end-to-end assembly solutions, including PCBAs, enclosures, wire harnessing, mechanical, integration, and final testing, ensuring a turnkey solution for OEMs.
In-circuit Testing ensures performance & reliability using custom testers. Comprehensive Quality inspections and AOI ensure zero-defect products meeting international standards.
Delivers precise solder paste deposition for consistent,
high-yield assemblies
Checks solder paste height and volume inline, preventing
defects before placement
Our Yamaha YRM20 high-speed placement system ensures
micron-level accuracy for components from 01005 chips to
complex BGAs, guaranteeing both speed and flexibility in assembly
We use Heller 10+3 zone reflow ovens with nitrogen atmosphere, delivering perfect solder joints and void-free connections through advanced thermal profiling.
Inline Yamaha AOI systems check solder joints, polarity and placement in real time, ensuring zero-defect boards.
Delivers consistent through-hole
soldering with precision and repeatability.
Ideal for high-volume THT, ensuring
strong and uniform solder joints.
Stress-free PCB depaneling prevents cracks
and protects delicate components.
Ensures every board is defect-free and
performs under real-world conditions.
Automated coating protects PCBs from dust, moisture, and harsh environments.